ESMC holds topping-out ceremony for Dresden chip plant
- Location
- Dresden, Saxony · 🇩🇪 Germany
- Project
- ESMC chip fab Dresden (TSMC, Bosch, Infineon, NXP joint venture) — topping-out ceremony
- Investment
- €10 billion
- Status
- Under construction
About two years after construction began, the shell of the ESMC chip plant in Dresden is complete; a topping-out ceremony was held on 14.09.2026, with interior fit-out and equipment installation now starting. The joint venture of TSMC (70%) with Bosch, Infineon and NXP (10% each) is investing around €10 billion, including €5 billion in German federal subsidies; some 2,000 jobs are planned and production is due to start in 2027. It is TSMC's first European production site (Evertiq, 16.09.2026; Oiger, 13.09.2026). Date is a placeholder for the start of production planned in 2027 (only the year is known). Announced on 14 September 2026 (topping-out ceremony).
Source: evertiq.de ↗ · Archived copy ↗
Evidence: one source · archived copy saved · second source missing (two-source rule) · How well sourced is Eurotrack?
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